Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join NEPCON Asia held at Taipei Nangang Exhibition Center, Hall 1 from December 28 – 30, 2021. Visit booth #I3116 to experience the latest in Smart Factory Semiconductor Inspection.
Join TRI at SEMICON Taiwan 2021 to discover TRI’s AI-powered Inspection solutions. TRI will showcase the recently released 3D SPI, TR7007Q Plus, equipped with an improved motion controller and enhanced 2D lighting for sharper inspection images.
Also exhibiting will be the 3D Semiconductor and Advanced Packaging Optical Inspection TR7900Q SII for semiconductor industry applications with built-in magazine loader/unloader, 2.5 µm high resolution, and an outstanding 25MP camera. The TR7900Q SII can inspect Die Bonding, Ball Bonding, Wire Bonding, Epoxy, and Foreign Material Detection. The 2021 SEMICON Taiwan lineup will include an offline X-ray Inspection Demo with CT capabilities. TRI will also showcase the AI Verify Host, the AI-powered repair station that reduces the need for manual re-inspection and lowers operational costs.
Realise your production line’s potential with TRI’s Test and Inspection solutions and Industry 4.0 data-driven management system, YMS 4.0. TRI’s systems are designed to interoperate with other manufacturing equipment to minimise downtime, optimise production quality, and reduce operator workload.